This blog post provides details about two vulnerabilities found by Quarkslab's researchers Guillaume Delugré and Kévin Szkudłapski in the secure boot feature of the i.MX family of application processors [1] built by NXP Semiconductors.

The bugs allow an attacker to subvert the secure boot process to bypass code signature verification and load and execute arbitrary code on i.MX application processors that have the High Assurance Boot feature enabled. These bugs affect 12 i.MX processor families.

The vulnerabilities were discovered and reported to the vendor in September 2016 and the technical details included in this blogpost were disclosed in a joint Quarkslab-NXP presentation at the Qualcomm Mobile Security Summit 2017 [2] in May 19th, 2017. National computer emergency response teams (CERTs) from 4 countries were informed about the issues in March, 2017.

NXP has issued an Engineering Bulletin and two Errata documents (EB00854, ERR010872 and ERR0108873 respectively) [3] providing a brief description of both vulnerabilities, the list of affected processor models along with resolution plans and possible mitigations.

In the rest of the blogpost we describe the relevant features in i.MX processors and the vulnerabilities affecting them.

In my previous article [1], I explained how to load Samsung's proprietary bootloader SBOOT into IDA Pro. The journey to the TEE OS continues in this second article which describes two techniques to locate Trustonic's TEE <t-base in the binary blob.

Various Samsung Exynos based smartphones use a proprietary bootloader named SBOOT. It is the case for the Samsung Galaxy S7, Galaxy S6 and Galaxy A3, and probably many more smartphones listed on Samsung Exynos Showcase [1]. I had the opportunity to reverse engineer pieces of this bootloader while assessing various TEE implementations. This article is the first from a series about SBOOT. It recalls some ARMv8 concepts, discusses the methodology I followed and the right and wrong assumptions I made while analyzing this undocumented proprietary blob used on the Samsung Galaxy S6.